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| SHAR APPROVED BY: DATE: ELECTRONIC COMPONE GROUP SHARP CORPORATION SPECIFICATION I I .DEVICE SPECIFICATION REGULATOR FOR Applied model name 122 I 1 I I 1 VOLTAGE MODEL No. PQ070XZO 1 PQ070XZ012 1 PQO7OXZO IZP 1. These specification sheets include materials protected under copyright of Sharp Corporation Please do not reproduce or cause anyone to reproduce them without Sharp's consent. (`Sharp"). 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specihcation sheets. as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximrim ratings and the instructions included in these specification sheets. and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas ; OA equipment * Audio visuaI equipment Home appliances * Telecommunication equipment (Terminal) * Measuring equipment - Computers [ * Tooling machines If the use of the product in the above application areas is for equipment listed in paragraphs (21 or (3). please be sure to observe the precaulions given in those respective paragraphs. l l 1 (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for eqUi~Jmcr1~ which demands high reliability and safety in function and precision. such as : * Transportation control and safety equipment (aircraft. train. automobile etc.) * TrafIIc signals * Gas leakage sensor breakers * Rescue and security equipment - Other safety equipment [ (31 Please do not use this product for equipment which require extremely-high reliability ,L. and safety in function and precision. such as : i s Space equipment * Telecommunication equipment (for trunk lines) * Medical equipment [ - Nuclear power control equipment 1 /( 1 1 (4) Please contact and consuit with a Sharp sales representative regarding interpretation of the above three paragraphs. I. Please contact and consult with a Sharp sales representative if there are any questions about this product for any questions DATE PRESENTED BY CUSTOMER'S APPKOVAL &I DATE BY K. Hachimura. Department General Managcr Enginrerin~ Dept..11 Opto-Electronic Devices Div. ELECDM Grottp SHARP CORPORATION of SHflRP CORPORATION 1. Application This specification applies to the outline Model No. PQ070XZO 12. and characteristics of series regulator (linear type), Usage PQO7OXZOlZ is the device for stabilization of positive output voltage with built-in ON/OFF function, the over current protectfon function, the overheat protection function, adjustable DC output voltage by using external resistance and low consumption current at OFF-state (stand-by). These devices are possible to use in power supply circuit up to current capacity l.OA. Block diagram Vin Vadj CND 2. Outline : Refer to the attached sheet, Page 3. sheet, page 4 to 8. 3. Ratings and characteristics maximum : Refer to the attached ratings 3.1 Absolute 3.2 Electrical 3.3 3.4 Electrical Pd-Ta characteristics characteristf (Typical cs measuring value) circuit . (. rating i\ 4. Reliability 5. Outgoing : Refer to the attached inspection sheet, Page 9. 10. sheet, Page 10. : Refer to the attached SHRHP CORPORflTION 6. Supplement 6.1 Example 6.2 Output : Refer to the attached of application voltage adjustment and reel packaging (PQ070XZO sheet, Page 11 to 17. characteristics (PQ070XZO 122) IZPI 6.3 Taping 6.4 6.5 Sleeve packaging ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production for this product. Materials 6.6 Brominated for ODS : CFC,, Halon, Carbon tetrachloride, 1.1-l -Trichloroethane (Methylchloroform) process flame retardants such as the PBBOs and PBB, are not used Specific brominated flame retardants in this device at all. 6.7 This product is not designed as electromagnetic and ionized-particle radiation resistant. 7. Notes : Refer to the attached 7.1 External 7.2 Thermal 7.3 Static connection protection electricity design sheet, Page 18 to 2 1. 7.4 Soldering 7.5 For cleaning ;`. i1 SHMP CORPORFITION 2. Outline h ii ,?. j-1 4 DC inptt (Vin) ON/OFF control WC) DC output (Vo) output voltage adjust.ment (Vadj) 5. GND Applied model No. (,9,,&01z2 I r Marked model No. 070xz01 o7oxzo I 1 - [ 1 : TYP. - Unit : mm *Scale: 5/1 - Lead finish : Solder plating - Lead material : CII' * Product mass : 0.3g I Pyo7oxzo 1ZP I 1I SHflRP CtlRPORflTION 3. Ratings and characteristics maximum ratings Ta=25% Parameter Symbol P 11 voltage P 1) Vin vc Rating IO 10 Unit V V Conditions 3.1 Absolute Input voltage control ON/OFF Output voitage adjustment pin t*u Vadj 5 V Output current (*a IO 1 8 150 -40 to +85 -40 to +150 260 I A W % Power dissipation Junction Operating temperature temperature Pd -Cl Topr Tstg Tsol Refer to Fig. 1 (*3) `C % % For 10 s Storage temperature Soldering temperature (* 1) All are open except GND and applicable (*2) Pd : With infinite heat sink terminals. (`31 There is case that over heat protection operates at the condition Tj=125C to 15o'C I (, i\ SHARP CORPORATION Fig. 1 Pd - Ta rating Power dissipation Pd WI Ambient temperature Ta (C) Pd : With (Note) infinite heat sink function operates at oblique line portion. There is case that over heat protection ;`. i SHflRP CORPORflTI ON 3.2 Electrical characteristics Unless otherwise specified condition shall be Vin=SV. Vo=3V (Rl=lkQ). Io=O.SA. Vc=2.7V Ta=25% Parameter Input Output voltage voltage Symbol Vin vo RegL RegI MIN. 2.35 1.5 TYP. 0.2 0.2 MAX. 10 7 2.6 1.0 Unit V V % % Io=FimA to l.OA Conditions Load regulation Line regulation Vin=4 to 8V 10=5mA Refer to Fig.3 Vin=2.85V, lo=O.tiA Ripple Dropout rejection voItage voltage coefficient voltage RR Vi-o Vref TcVref 45 1.225 - 60 1.25 fl.O 0.5 1.275 - dB v V % Reference Temperature of reference On-state control On-state control Off-state control Off-state control Quiescent Tj=O to 125% io=5mA t*41 voltage for current for Vc (on) 2.0 - 200 V pA lc (on) - - voltage for current current for vc (on) - - 0.8 2 V Io=OA Ic (OffI - 1 1/ t. PA mA PA Io=OA, Vc=O. 4V t to:OA vc=o.4v 19 Iqs - 2 5 Output off-state consumption current (*4) In case of opening control - terminal (2th pin), output voltage turns OFF. SHflRP CORPORATION 3.3 Electrical characteristics measuring measuring circuit circuit of Regulator portion Fig. 2 Standard Vo=VrefX( l+R2/RI) ~1.25X(1+IU/RlI (Rl=lkQ, Vref+1.25Vl Vin r I1 R2 vo I----+ / 1$ 0, 833 r T T n I: V Fig. 3 Standard measuring circuit of critical rate of ripple rejection f= 120Hz sine wave ei(rms)=0.5V Vin=5V Vo=3V (Rl=IkR) Io=O.3A RR=20 1og (ei(rms)/eo(rms)) 1 Q3 T T r SHARP CORPORATION 3.4 Pd - Ta rating (Typical value) Power dissipation Pd W'l Ambient temperature Ta (`Cl I (b i I Mounting PCB PC6 - Copper foil Material : Class-cloth epoxy resin Size : 50 X 50 X 1.6mm Thickness of copper : 35 pm SHARP CORPORATION The reliability of products shall satisfy items listed below. Contfdence level : 90% LTPD : 10%/200/6 Test Conditions Failure Judgement Crl teria _ Test items Temperature cycling Humidity (Steady State1 1 cycle -40C to + 150% (30min) (30min) 20 cycles test +60% .9O%RH. lOOOh Vref Vref>UX1.2 n=22. C=O Damp Heat cyclic 1 cycle : -20% (2hl Transfer time and low temp. 40 cycles test. +150%. lOOOh to 70% @h) between high is 1h. 9O%RH RegL>UX 1.2 n=22. c=o RegI>UX 1.2 High temp. Low temp. Operation Mechanical storage storage life shock RR< LX0.8 Vi-o > UX 1.2 n=22. C=O n=22. C=O -40-C, 1 OOOh Ta=25"C. Pd=0.8W, lOOOh n=22. c=o n=ll. C=O 15000m/s2, 0.5ms 3 times/ +X. +Y. +Z 200m/s2, 100 to 2000 to lOOHz/4 min 4 times/ X. Y, 2 direction +25OV, 200pF. OQ Between GND and each terminal/ 3 times Vibration (Variable frequency] Electrostatic discharge Soldering heat U: Upper specification limit L: Lower specif,Qation limit i 1I n=ll. C=O n=l1. n=ll. C=O C=O C=O 260C. 0.5mm 10 s, Dip up to from resin portion `2 `1 n=ll. Failure if it has breakdown and loosened pin. l4 Robustness of Termination (Tensile test) Robustness Termination (Bending of test) Weight: I ON 10 s/ each terminal Weight: 2.5N -0' On -go' each terminal -go' `3 -0' n=i 1. C=O Solderability 23Ok5'C. 520.5 s Use rogin Rux l l Failure if solder shall not be adhere at the area of 95% or more dipped portion. l5 n=ll, C=O SHARP CORPORATION * 1 SoIdering below. area is shown OSmm Weight *3 Terminal bending is shown below. direction *4 Except for the bending of terminal. *5 Except for the portion within 0.5mm from the interface between the heat sink and the resin portion, and the side surface of heat sink. J, Weight 5. Outgoing inspection . TABLE II-A single sampling plans for normal inspection based on&O The AQL according to the inspection items are shown below. Defect Inspection Electrical Unreadable Minor defect Appearance 0.4 Dimensions items AQL (o/o) 285$ is applied. Judgemen criteria t Major defect characteristics 0.1 marking Depend on the specihcation SHflRP CORPORATION 6. Supplement 6. I Example of application DC input T R2 T VO Yin/ j-CM I -II ON-OFF signal + zczco Rl 1kQ - Load High : Output ON or Open : Output OFF I . (. i SHARP CORPORATION 6.2 Output voltage adjustment characteristics Rl=?kS2 I 6 I 1 I I I I I I I i I / I output v&age I t I I I SHARP CORPORATION 6.3 Packing 6.3.1 specifications conditions (PQ070XZO UPI Packing (1) Tape structure _ and Dimensions (Refer to Fig. A) The tape shall have a structure in which a cover tape is sealed heatpressed on the carrier tape of polystyrene emboss protect against static electricity. Dimensions are shown Fig. A. and Dimensions (Refer to Fig-B) Dimensions are shown Fig. B. (2) Reel structure The reel shall be made of polystyrene. (3) Direction of product insertion (Refer to Fig. C) tape shall direct to the radiate fin of product at Product direction in carrier the hole side on the tape. 6.3.2 Tape characteristics of cover tape ( 1) Adhesiveness The peel-back force between carrier tape and cover tape shall be 0. IN to O.8N for the angle from 160' to 180. . (Tape speed : 5mm/s) (2) Bending strength Sealed tape : Bended tape radius shall be more than 30mm. If bended tape radius is less than 30mm. there is case that cover tape come otf carrier tape. (3) Carrier 6.3.3 Rolling tape : Bended method method tape radius shall be more than 15mm. and quantity (. i\ (1) Rolling Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20 pitch of empty cavities to the trailer and attach more than 10 pitch of empty cavities to the leader of the tape and fix the both ends with adhesive tape. (2) Quantity One reel shall contain 3000 PCS. SHflRP CORPORATION 6.3.4 Indication (1 ) Reel The reel shall be pasted labei * Model No. (2) Package case The outer packaglng l l with following information. * Production date Number of pieces contained case shall be marked of pieces contained with following * Inspection information. date Model No. condition l Number 6.3.5 Storage Taped products shall be stored at the temperature lower than 5 to 30-C and the humidities lower than 7O%RH. If taped products aren't used longer than for -10 days, Please rewind the tape pulled out and storage. 6.3.6 Others of tape and carrier tape in one reel shal1 be jointless. devices (1) joint The cover tape (21 The way to repair taped failure The way to repair taped failure devices cut a bottom of carrier tape with a cutter. and after replacing to good devices, the cutting portion shall be sealed with adhesive tape. Fig. A Tape structure and Dimensions - Dinwnsions : `p/P. ValIW Unit : mm SHRRP CORPURRTION March 7. 2000 Fig. B Reei structure and Dimensions Dimensions : TYP. value Unit : mm Fig. C Direction of product insertion SHARP CORPORATION 6.4 Sleeve pat kaglng 6.4.1 Packing (PQ070XZO I ZZ) conditions and Dimensions (Refer to Fig. D) ( 1) Sleeve structure . The sleeve shall be made of high inpuct polethyiene (Plastics wtth preventing static electricity). Dimensions are shown Fig. D. case shall be made of corrugated are shown Fig. F. cardboard. (2) The packing Dimensions (3) Stopper structure shall be made of styrene butadlene rubber. The stopper 6.4.2 Packaging method method and quantity (1) Packagfng Max. 75pcs. of products shall be packaged in a sleeve and both of sleeve edges shall be fu (1) Packing The packing * Model No. case shall be marked * Number with following information. * InspectionI (. date i\ of pieces contained Fig. D 2Sleeve \ $Stopper (With pulled portion) 4 0 sleeves Fig. E ( 1 0 IinesX Fig. F \ / \ &i&2 ' L / (568) Inspection date I SHflRP CORPORRTlON 7. Notes 7.1 External connection C-MOS or TTL (11 Please perform shortest wiring for connection between Cin, Co and the individual terminal or fin. There is case that oscillation occurs easily by kinds of capacitor and capacity. Before you use this device, you should confirm output voltage on your use mounting state. (2) The input terminal for ON/OFF output control : `2' is compatible with LS-TTL. and direct driving by TTL or C-MOS standard logic (RCA 4000 series) is also available. In case that ON/OFF terminal is not used. we recommend to connect the ON/OFF terminal directly to the input terminal : i input voltage. (3) As voltage application under conditions that the device pin is inserted divergently or reversely, may occur the degradation of characteristics or breakdown of the device, please avoid it absolutely. 7.2 Thermal Internal protection design (Pd) of device is obtained 1 (. by the following i eflriation. power dissipation Pd=IoX(Vin-Vo)+VinXlq If the ambient temperature and Pd at the device operating state. make the thermal design enough to radiate the heat as allows the device to operate within the safety operation area specified by the derating curve in para. 3.4. Insufficient radiation gives an unfavorable intluence to the normal operation and reliability of the device. In the case of no passage within the safety operational territory illustrated by the derating curve. the overheat protection circuit operates to let output fall down, please avoid keeping such condition for a long time. Good caution must be exercised against static electricity since this device consists of a bipolar IC. Following-are some examples of preventive measures against excessive voltages such as caused by static electricity. (a) Human body must be grounded or cloth. (b) Anything inserter. to discharge the static electricity from the body that is in contact with the device such as workbench, or measuring instrument must be grounded. (c) Use a solder dip basin with a minimum leak current (isolation resistance 10MQ or more) from the commercial Also the solder dip basin must be grounded. 7.4 Soldering (I) Reflow soIdering It is and (The It is room recommended that the time within the temperature shown recommended that temperature. power supply. within two times soldering be done at the temperature temperature profile as shown in the figure. in the figure is fin portion temperature of the device.) the second reflow become at the device which is the (a) An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. The temperature of resin portion should be with in the temperature profile below. (b) The temperature 240C sloping when soldering-reflow is 4C /s or less. 180C 25% 3nnnr Lunrunnl fu(* (21 Dip soldering We recommend that solder dip should be 260% (Bolder temp.) Please obey the note items below concerning solder reflow. (a) After solder dip. please do cooling (bl Please shaIl not give the mechanical (3) Hand soldering This device is basically designed for the soldering such as reflow soldering or dip soldering. In case when hand soldering is reluctantly needed for modification etc., it is recommended that only one hand soldering should be done at 260C or less of soldering iron edge. temperature. for 10s or less. Please be careful not to touch soldering iron edge to leads directly etc. in order not to give any stress to the leads. Even within the above conditions regarding solder reflow, solder dip or hand soldering there is the possibility that the stress given to the terminals by the deformation of P(X3 makes the wire in the device package cut. In advance, please confirm fully at the actual application. naturally. stress or the impact stress to the device. 10s or less and 1 time only. 7.5 For cleaning (1) Solvent cleaning : Solvent temperature 45% or less immersion for 3 min or less : The effect to device by ultrasonic cleaning differs by cleaning bath size. ultrasonic power output, cleaning time. PCB size or device mounting condition etc. Please test it in actual using condition and confhm that doesn't occur any defect before starting the ultrasonic cleaning. : Ethyl alcohol. Methyl alcohol, Isopropyl alcohol (2) Ultrasonic cleaning (3) Applicable solvent In case when the other solvent is used. there are cases that the packaging resin is eroded. Please use the other solven,t after thorough confirmation is performed in actual using condition. i ' SHRRP CORPORfnIUN 7.6 Output voltage fine tuning Connecting external resistors R1 and R2 to terminals 3 , 4 . 5 ailows the output voltage to be fine tuned from 1.5V to 7. Refer to the tlgure below and "Paragraph 6.3 Output voltage adjustment characteristics" when connecting external resistors t'or Ane tuning output voltage. +R2/RI) +1.25x( 1+R2/ 1000) (RI=lkR. Vref+1.25VI II (. i\ |
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